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Campus recruitment

: 硬件开发实习生

Place:南京 Years:在校生/应届生 Education:本科以上
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Job description:

1、协助硬件工程师举行PCB布板；；；；；；；

2、协助测试工程师举行产品测试；；；；；；；

3、凭证要求制订、整理手艺文档，，，，，包括生产调试指导文件、测试报告等。。。。。。

Job requirements:

1、协助硬件工程师举行PCB布板；；；；；；；

2、协助测试工程师举行产品测试；；；；；；；

3、凭证要求制订、整理手艺文档，，，，，包括生产调试指导文件、测试报告等。。。。。。

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Relevant positions

销售代表 助理工程师 硬件开发实习生

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Head Office : 1# Building, No. 18 Meilin Street, Moling Sub-district, Jiangning District, Nanjing City, Jiangsu Province, China Zip code : 211102 Tel / Fax : 86 25 81032909 Service mobile phone : 86 19951939432 （24 Hours） E-mail : horbon@horbon.com Web : www.horbon.com

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